4901 Sn99 No-Clean Solder Wire is a solder wire for electronics. It uses a high-purity eutectic Sn99.3/Cu0.7 alloy, complemented by a no-clean, synthetically refined, spatter-proof resin flux core. 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.

• Eutectic alloy (liquidus = solidus temperature)
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Resin spreads like rosin-activated flux
• Virtually non-spattering
• Non-corrosive
• Non-conductive
• Halide-free
• Suitable for Use in Food Facilities as a Non-Food Chemical

4901 lead-free solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire